Effect of Dynamic Flexural Loading on the Durability and Failure Site of Solder Interconnects in Printed Wiring Assemblies

This dissertation investigates the durability of solder interconnects of area array packages mounted on Printed Wiring Assemblies (PWAs) subjected to dynamic flexural loads, using a combination of testing, empirical curve fitting and mechanistic modeling. Dynamic 4-point bend tests are conducted on a drop tower and with an impact pendulum. Failure data is collected and an empirical rate-dependent durability model, based on mechanistic considerations,…

Author: Varghese, Joseph

Source: University of Maryland

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