ISOTHERMAL MECHANICAL AND THERMO-MECHANICAL DURABILITY CHARACTERIZATION OF SELECTED PB-FREE SOLDERS

Because of the hazards of Pb in the atmosphere as well as its affect on humans and marketing competition from Japanese electronics manufacturers, the transformation to Pb-free solders in the electronics market seems expected. As significant mechanical, thermal, and electrical interconnects involving the component and the PWB, solder joints are very important for the longevity of the most electronic packages. We have an urgent requirement for constitutive properties, mechanical sturdiness and thermo-mechanical reliability of Pb-free solders. A partitioned constitutive model composed of elastic, plastic, primary creep and secondary creep models is obtained for the Sn3.9Ag0.6Cu solder and the baseline Sn37Pb solder from extensive monotonic and creep tests carried out on Thermo-Mechanical-Microscale (TMM) setup. The comparison between 2 solders shows that Sn3.9Ag0.6Cu has significantly superior creep resistance than Sn37Pb at the low and medium stresses. The isothermal mechanical reliability and durability of 3 NEMI suggested…

Source: University of Maryland

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