Damage Initiation and Evolution in Voided and Unvoided Lead Free Solder Joints Under Cyclic Thermo-Mechanical Loading

The effect of process-induced voids on the durability of Sn-Pb and Pb-free solder interconnects in electronic products is not clearly understood and researchers have reported conflicting findings. Studies have shown that depending on the size and location, voids are not always detrimental to reliability, and in fact, may sometimes even increase the durability of joints. This debate is more intensified in Pb-free solders…

Author: Jannesari Ladani, Leila

Source: University of Maryland

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