Characterization, Modeling, and Optimization of Polymer Composite Pin Fins

Increasing electronic product manufacturing volumes and cooling requirements necessitate the use of new materials and innovative techniques to meet the thermal management challenges and to contribute towards sustainable development in the electronic industry. Thermally conductive polymer composites, using high thermal conductivity fillers such as carbon fibers, are becoming commercially available and provide favorable attributes for electronic heat sinks, such as low density and fabrication energy requirements. These polymer composites

Author: bahadur, raj

Source: University of Maryland

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