Concurrent vibration and thermal environment is commonly encountered in the service life of electronic equipment, including those used in automotive, avionic, and military products. Though extensive research exists in literature for solder joint failures due to thermal cycling, limited research has been conducted on investigating solder joint failures due to a combination of vibration and thermal cycling. In this study, experiments were conducted on PBGA assemblies under thermal cycling…
Author: Qi, Haiyu
Source: University of Maryland
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