The current study goes over a design methodology for thin, two-phase heat spreaders for space constrained cooling applications. The evaporator section of the heat spreader employs enhancement structures to improve the spreader plate performance. The thermal performances of two such spreader prototypes,
Increasing electronic product manufacturing volumes and cooling requirements necessitate the use of new materials and innovative techniques to meet the thermal management challenges and to contribute towards sustainable development in the electronic industry. Thermally conductive polymer composites, using high thermal conductivity fillers
Outdoor applications of electronics modules expose the systems to harsh environmental conditions. When very high performance is required, it may be necessary to actively stabilize the temperature in the module. This thesis presents a systematic approach to the problem of designing a