Temperature stabilization of electronics module

Outdoor applications of electronics modules expose the systems to harsh environmental conditions. When very high performance is required, it may be necessary to actively stabilize the temperature in the module. This thesis presents a systematic approach to the problem of designing a temperature stabilized environment for medium size electronics modules.

The target system is the front-end electronics for the antennas in the EISCAT_3D incoherent scatter radar system. This will be placed in northern Scandinavia, with estimated outdoor temperature span from -40C to 40C. Very high demands on precision and timing will most likely require a temperature stable environment. The present state in high performance thermal management of electronics focuses on single circuit design. Thus the need of designing a temperature stable module which could hold the entire front- end electronics was recognized. The electronics have an estimated constant power dissipation of about 10 W.

Both simulations and measurements clearly show the feasibility of the proposed design, with temperatures kept to close tolerances. Critical parts can be attached to the aluminium heat spreader while less critical can be positioned above. The use of a completely enclosed box without rotating parts should provide long life expectations.

Author: Gabert, Anders

Source: Lulea University of Technology

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