Engineering Project Reports, Dissertation, Engineering Thesis, Working Papers, Examples, Tips, Resources and Information
An experimental study was conducted to measure the heat transfer characteristics and pressure drop of supercritical Carbon Dioxide (CO2) in gas cooling conditions while flowing through a horizontal micro channel. Five experiments were conducted at operating conditions that included an inlet temperature
There are many types of products and systems that have lifecycles longer than their constituent parts (specifically COTS – Commercial Off The Shelf parts). These lifecycle mismatches often result in high sustainment* costs for long field life systems (e.g., avionics, military systems,
High thrust-to-weight ratio and consistent performance over a range of operating conditions make cryogenic rocket engines one of the best options for space propulsion. However, future space explorations and missions to moon, mars and beyond require improvements in our present knowledge of
Lab-on-chip (LOC) devices have miniaturized routine laboratory processes for automated, high-throughput chemical analysis. Separations of biomolecules, including protein and DNA, have been performed with high efficiencies in LOC devices, but the need for improved fluid flow control, i.e. pumping and valves, remains
The popularity of 3D CAD systems is resulting in a large number of CAD models being generated. Availability of these CAD models is opening up new ways in which information can be archived, analyzed, and reused. 3D geometric information is one of
Solder-dipping may be used to replace tin-rich finishes with eutectic tin-lead for tin-whiskering risk mitigation purposes. However, re-finishing also subjects electronic parts to new risks, including damage from the thermal re-finishing profile, finish non-uniformity, incomplete replacement of the pre-existing finish and poor
Power semiconductor devices are used in a wide range of applications. In these applications, power semiconductor devices are required to handle large currents and as a result they tend to dissipate large amounts of heat. In addition, the device and their attendant
Conventional plastic encapsulated microcircuits (PEMs) are increasingly being used in harsh environments such as automotive, well-logging, aerospace and military applications. There is a need, therefore, to examine their performance and reliability at high temperatures. A commonly used first level interconnect in PEMs
This dissertation investigates the durability of solder interconnects of area array packages mounted on Printed Wiring Assemblies (PWAs) subjected to dynamic flexural loads, using a combination of testing, empirical curve fitting and mechanistic modeling. Dynamic 4-point bend tests are conducted on a
In this thesis, dynamics of low immersion milling is explored through analytical and numerical means. Using linear and nonlinear cutting force models, maps are constructed for single degree-of-freedom and two degree-of-freedom systems where the time spent cutting is “small” compared to the