Engineering

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Characterization, Modeling, and Optimization of Polymer Composite Pin Fins

Increasing electronic product manufacturing volumes and cooling requirements necessitate the use of new materials and innovative techniques to meet the thermal management challenges and to contribute towards sustainable development in the electronic industry. Thermally conductive polymer composites, using high thermal conductivity fillers

Characterization of Electrically Active Defects in Advanced Gate Dielectrics

As the gate oxide thickness of the metal-oxide-semiconductor (MOS) Field Effect Transistor (FET) is continuously scaled down with lateral device dimensions, the gate leakage current during operation increases exponentially. This increase in leakage current raises concerns regarding device reliability. Substitute dielectrics with