Electromagnetic Interference (EMI) in electronic devices is one of the major challenges in the design of high-speed electronic packages. These challenges are intensified by the increase in the level of system integration and the ever-increasing operating frequency of microprocessors. EMI takes place at different levels including the package, board, component and chip. The physical mechanism behind electromagnetic interference is the coupling of energy between different EM sources. This coupling can be either conducted or radiated. However, regardless of the coupling mechanism, surface currents are needed to support the field that eventually radiates, which constitute the electromagnetic interference in the first place. Minimizing these surface currents is considered a fundamental and critical step in minimizing EMI. In this work, novel strategies are proposed to confine surface currents in enclosures and cavities. Unlike the traditional use of lossy materials and absorbers, which suffe…

Author: Mohajer Iravani, Baharak

Source: University of Maryland

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Chapter 1 : Introduction
Chapter 2 : Problem and Challenges
Chapter 3 : Classical Solutions
3.1. Electromagnetic Interference Reduction in Packages and Enclosures
3.1.1. Change in configuration of openings
3.1.2. Implementing Lossy Material to Enclosures and Openings
3.1.3. Design of Package according to PCB features
3.2. Electromagnetic Interference Reduction in Cavity Backed Slot Antennas
3.2.1. Implementing Lossy Materials
3.2.2. Slit on the Ground Plane
3.2.3. Change in Configuration
3.2.4. Separation Distance
Chapter 4 : Electromagnetic Band Gap (EBG) Materials
4.1. EBG Structures
4.2. Design of EBG Structures
4.2.1. Scattering parameters
4.2.2. Dispersion Diagram
4.3. Surface Wave
4.4. EM wave mitigation using EBG materials
4.4.1. Antenna
4.4.2. Power planes and Printed Circuit Boards
4.4.3. Signal Integrity on PCBs
Chapter 5 : Application of EBG Materials for EM Noise Suppression
5.1. New EMI Shielding Approach in Enclosures Using EBG
5.1.1. Methodology
5.1.2. Numerical Simulation and Validation
5.2. Surface Wave Suppression in Cavity Backed Slot Antennas
5.2.1. Methodology
5.2.2. Numerical Simulation and Validation
5.3. Effect of two different Configurations of the same EBG Pattern on the Band Gap
5.3.1. Configurations
5.3.2. Simulation Result
Chapter 6 : Summary and Future work

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