Solder-dipping may be used to replace tin-rich finishes with eutectic tin-lead for tin-whiskering risk mitigation purposes. However, re-finishing also subjects electronic parts to new risks, including damage from the thermal re-finishing profile, finish non-uniformity, incomplete replacement of the pre-existing finish and poor solderability from re-finishing. This study overviews solder-dipping as a re-finishing technique and identifies key process and part parameters that could result in risks….
Author: Sengupta, Shirsho
Source: University of Maryland
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